Longsys Unveils Advanced Embedded Storage Solutions at MWC 2026 to Power On-Device AI

Under the theme “AI Storage for the Mobile World,” Longsys highlights next-generation integrated storage innovations for smartphones, wearables, AI PCs, and robotics

BARCELONA Longsys (301308.SZ), a globally recognized branded semiconductor memory enterprise, is presenting its latest embedded integrated storage solutions at MWC 2026. Showcasing under the theme “AI Storage for the Mobile World,” the company is demonstrating how its advanced technologies are enabling high-performance, precision-driven storage to support the rapid evolution of on-device artificial intelligence (AI).

As AI-powered terminals continue to advance—from smartphones and wearables to PCs and embodied robots—the demands placed on storage systems have intensified. Modern AI devices require higher capacity, faster data throughput, lower power consumption, and seamless system-level integration. In response, Longsys is leveraging its expertise in controller design, firmware algorithms, advanced packaging, and manufacturing to transition from a traditional storage provider into a value-driven, integrated semiconductor memory solutions company.

At MWC 2026, Longsys is spotlighting a comprehensive portfolio tailored for AI Mobile, AI Wearable, AI PC, and robotics applications, each designed to meet the specific performance and efficiency requirements of next-generation intelligent devices.

High-Performance and Cost-Optimized Storage for AI Mobile Devices

To address global DRAM supply-demand challenges, Longsys has introduced its proprietary HLC (High Level Cache) technology integrated into UFS storage products. This innovation enables UFS modules to manage warm and cold data that would traditionally be handled by DRAM. By reducing reliance on DRAM at the device level, manufacturers can lower bill-of-material (BOM) costs while preserving smooth system performance.

This capability is particularly beneficial for AI smartphones, tablets, and embodied robots, where efficient data management is critical for real-time processing and user experience. The result is a storage solution that balances performance and cost without compromising responsiveness.

Longsys is also advancing its UFS lineup through the integration of pTLC (pseudo-TLC) technology. Through intelligent firmware-based switching among QLC, TLC, and SLC modes, pTLC enables TLC-grade data retention while delivering cost advantages over native TLC solutions. This approach optimizes endurance, capacity, and performance—key factors in AI-driven mobile applications that process increasingly complex workloads.

Ultra-Compact Storage for AI Wearables

As AI glasses and smartwatches emerge as high-growth segments, storage modules must meet stringent space and energy constraints. Longsys is showcasing its ePOP5x, ePOP4x, and Subsize eMMC solutions designed specifically for compact AI wearable devices.

The flagship ePOP5x maintains the same footprint as its predecessor but reduces thickness by 35 percent to just 0.52 mm. It doubles DRAM speed to 8533 Mbps and supports flexible capacity configurations, making it well-suited for next-generation smart eyewear and wearable computing platforms. These enhancements deliver the compact form factor, high speed, and low power consumption necessary for lightweight, always-on AI wearables.

High-Throughput Storage for AI PCs

For AI PCs and notebooks, real-time data processing and high-bandwidth workloads require storage solutions capable of minimizing latency and maximizing throughput. Longsys is highlighting its high-performance mSSD (micro SSD) storage medium, designed to deliver low latency and substantial bandwidth for demanding AI tasks.

Building on this technology, Longsys’s high-end consumer brand, Lexar, has developed what it describes as the industry’s first AI Storage Core architecture. This framework supports flexible, high-capacity, hot-swappable storage configurations optimized for AI notebooks and high-performance computing environments.

New product demonstrations include the AI-Grade Storage Stick tailored for AI laptops and the AI-Grade SSD engineered for advanced AI applications. These solutions aim to ensure that AI PCs can handle large datasets, model inference, and high-speed multitasking efficiently and reliably.

Building a Complete AI Storage Ecosystem

Longsys’s end-to-end capabilities—spanning controller design, storage medium research and development, firmware engineering, advanced packaging, and manufacturing—enable the company to deliver vertically integrated solutions. This holistic approach allows for deeper software-hardware co-optimization, ensuring that storage performance aligns precisely with the computational demands of AI-enabled devices.

By focusing on system-level integration and intelligent firmware control, Longsys is constructing a comprehensive AI storage ecosystem that addresses diverse use cases in the on-device AI era. Its solutions are engineered not only for speed and capacity but also for energy efficiency and long-term reliability.

About Longsys

Founded in 1999, Longsys is a globally leading branded semiconductor memory enterprise integrating research and development, design, packaging and testing, manufacturing, and sales services. Guided by its corporate vision, “Everything for memory,” the company emphasizes innovation in memory technology to provide high-end, flexible, and efficient full-stack customized services to customers worldwide.

With its showcase at MWC 2026, Longsys reinforces its strategic commitment to empowering the next generation of AI-powered devices through advanced, integrated storage solutions—positioning itself at the forefront of the rapidly expanding on-device AI landscape.